Opposing substrates of a vehicle window are laminated to one another using a polymer inclusive interlayer which has a notch or cut-out portion defined therein. Following lamination, at least one bus bar(s) supported by one of the substrates is exposed in this notch or cut-out portion of the interlayer. Then, an external connector may be electrically connected to the bus bar(s) at a location between the opposed substrates, by sliding a portion of the connector into a gap between the two laminated substrates at a location where the bus bar(s) is exposed due to the notch or cut-out in the interlayer. Because the connector can be electrically connected to the bus bar(s) after the lamination process, various techniques (e.g., nipper rolls, vacuum apparatus, etc.) may be used to laminate the substrates to one another prior to this electrical connection.