发明授权
- 专利标题： Semiconductor assembly with package using cup-shaped lead-frame
- 专利标题（中）： 半导体组件采用杯形引线框封装
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申请号： US10291153申请日： 2002-11-07
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公开(公告)号： US06909170B2公开(公告)日： 2005-06-21
- 发明人: Mike Chang , King Owyang , Yueh-Se Ho , Y. Mohammed Kasem , Lixiong Luo , Wei-Bing Chu
- 申请人： Mike Chang , King Owyang , Yueh-Se Ho , Y. Mohammed Kasem , Lixiong Luo , Wei-Bing Chu
- 申请人地址： US CA Santa Clara
- 专利权人： Siliconix Incorporated
- 当前专利权人： Siliconix Incorporated
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Murabito & Hao LLP
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L23/04 ; H01L23/34 ; H01L23/52
摘要：
A semiconductor package includes a leadframe which is cup-shaped and holds a semiconductor die. The leadframe is in electrical contact with a terminal on one side of the die, and the leads of the leadframe are bent in such a way that portions of the leads are coplanar with the other side of the die, which also contains one or more terminals. A plastic capsule is formed around the leadframe and die.
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