发明授权
- 专利标题： Contact for use in an integrated circuit and a method of manufacture therefor
- 专利标题（中）： 用于集成电路的接触及其制造方法
-
申请号： US10716299申请日： 2003-11-18
-
公开(公告)号： US06910907B2公开(公告)日： 2005-06-28
- 发明人: Nace Layadi , Alvaro Maury
- 申请人： Nace Layadi , Alvaro Maury
- 申请人地址： US PA Allentown
- 专利权人： Agere Systems Inc.
- 当前专利权人： Agere Systems Inc.
- 当前专利权人地址： US PA Allentown
- 主分类号： H01L21/768
- IPC分类号： H01L21/768 ; H01R13/28 ; H01R25/00
摘要：
The present invention provides a contact for use in an integrated circuit, a method of manufacture therefor, and an integrated circuit including the aforementioned contact. The contact, in accordance with the principles of the present invention, may include a via located in a substrate, and a contact plug located in the via, wherein the contact plug has a first portion having a notch removed therefrom and a second portion filling the notch.
公开/授权文献
信息查询
IPC分类:
