Invention Grant
- Patent Title: Lead-free chemical nickel alloy
- Patent Title (中): 无铅化学镍合金
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Application No.: US10399464Application Date: 2001-10-25
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Publication No.: US06911269B2Publication Date: 2005-06-28
- Inventor: Alfons Hollander , Heinz-Peter Becker
- Applicant: Alfons Hollander , Heinz-Peter Becker
- Applicant Address: DE Kerpen
- Assignee: AHC Oberflachentechnik GmbH & Co.
- Current Assignee: AHC Oberflachentechnik GmbH & Co.
- Current Assignee Address: DE Kerpen
- Agency: Fish & Richardson P.C.
- Priority: DE10052960 20001025
- International Application: PCT/DE01/04014 WO 20011025
- International Announcement: WO02/34964 WO 20020502
- Main IPC: C23C18/34
- IPC: C23C18/34 ; C22C19/03 ; C23C18/32 ; C23C18/36 ; C23C18/50 ; H05K3/18 ; H05K3/24 ; B32B15/01

Abstract:
Lead-free chemically produced nickel alloy containing nickel, phosphorus, bismuth and antimony, process for the production of such a nickel alloy by externally electroless metal deposition in an aqueous electrolyte and articles plated therewith.
Public/Granted literature
- US20040007472A1 Lead-free chemical nickel alloy Public/Granted day:2004-01-15
Information query
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