A cover assembly for covering an opening in an enclosure for an electronic device is described. The cover assembly includes a compliant fastening mechanism that is coupled to a cover and extends through the cover. With the cover in place over the opening, a first portion of the fastening mechanism is inside the enclosure and a second portion is outside the enclosure. The first portion engages with the lip of the opening, and the second portion provides leverage for disengaging the first portion from the lip. The cover can be installed and removed without using a tool.