The integration, packaging and assembly of optical components, optoelectronic components and submounts using features pressed into ceramic elements. The submounts may be composed of a ceramic material and contain optical and optoelectronic components. The submounts can be movable to change the optical characteristics of modules created through the integration of optical or optoelectronic components. Such modules can have functions including optical detection, optical signal generation, optical signal branching or processing, optical switching, optical multiplexing or de-multiplexing, optical modulation or optical transmission. The disclosure also provides an example, which is not meant to be limiting, of an optical module including two or more optical components and a packaging, integration and assembly platform.