发明授权
- 专利标题： Electronic parts mounting method and device therefor
- 专利标题（中）： 电子零件安装方法及其装置
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申请号： US09890066申请日： 2000-01-26
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公开(公告)号： US06926796B1公开(公告)日： 2005-08-09
- 发明人: Kazuto Nishida , Hidenobu Nishikawa , Yoshinori Wada , Hiroyuki Otani
- 申请人： Kazuto Nishida , Hidenobu Nishikawa , Yoshinori Wada , Hiroyuki Otani
- 申请人地址： JP Osaka
- 专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址： JP Osaka
- 代理机构： Wenderoth, Lind & Ponack, L.L.P.
- 优先权： JP11-021800 19990129; JP11-022015 19990129
- 国际申请： PCT/JP00/00372 WO 20000126
- 国际公布： WO00/45430 WO 20000308
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H05K3/32
摘要：
A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. The chip is pressed against the board with a pressure force of not smaller than 20 gf per bump by virtue of a tool, while warp of the chip and the board is corrected, the bumps are compressed, and the insulating resin is hardened.
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