A method for making thin film piezoelectric elements including forming a flat-plate laminate by laminating a first electrode layer, a piezoelectric thin film, and a second electrode layer, on one surface of an element forming substrate, and forming on the one surface a plurality of thin film piezoelectric elements including connecting electrodes for electrically connecting the first electrode layer and the second electrode layer to external equipment, including forming the element holding layer including resin over the one surface of the substrate including the thin film piezoelectric elements; bonding the one surface of the substrate, opposed to a temporary fixing substrate and covered with the element holding layer, on the temporary fixing substrate by using a fixing resin; covering a peripheral area with a specified width; and removing the element forming substrate by etching in an area other than the area covered with the fixing resin, and separating the thin film piezoelectric elements held by the element holding layer, into individually separate elements or groups of elements.