Invention Grant
- Patent Title: Method for increasing the copper to superconductor ratio in a superconductor wire
- Patent Title (中): 在超导体线中增加铜与超导体比的方法
-
Application No.: US10690850Application Date: 2003-10-22
-
Publication No.: US06932874B2Publication Date: 2005-08-23
- Inventor: William G. Marancik , Seung Hong
- Applicant: William G. Marancik , Seung Hong
- Applicant Address: US NJ Carteret
- Assignee: Oxford Superconducting Technology
- Current Assignee: Oxford Superconducting Technology
- Current Assignee Address: US NJ Carteret
- Agency: Klauber & Jackson
- Main IPC: C21D9/00
- IPC: C21D9/00 ; C22F1/16 ; C25D5/50 ; C25D7/00 ; H01B1/00 ; H01B12/00 ; H01L39/24
Abstract:
A method for producing a superconductor having a high copper to superconductor composition (Cu/SC) ratio by cross-sectional area. An assembly is prepared formed of one or more fine filaments of a superconductor composition or of a precursor component for a superconductor alloy composition, which filaments are embedded in a copper-based matrix. The assembly is electroplated with copper to increase the Cu/filament ratio in the resulting product, and thereby increase the said Cu/SC ratio to improve the stability of the final superconductor.
Public/Granted literature
- US20040209779A1 Method for increasing the copper to superconductor ratio in a superconductor wire Public/Granted day:2004-10-21
Information query
