发明授权
- 专利标题： Method and apparatus for mold clamping in an injection molding machine and the like
- 专利标题（中）： 注射成型机等中的模具夹紧的方法和装置
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申请号： US10409306申请日： 2003-04-09
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公开(公告)号： US06932924B2公开(公告)日： 2005-08-23
- 发明人: Makoto Nishizawa , Toshihiro Kasai , Kazuhito Kobayashi , Yukio Iimura
- 申请人： Makoto Nishizawa , Toshihiro Kasai , Kazuhito Kobayashi , Yukio Iimura
- 申请人地址： JP Tokyo
- 专利权人： Toshiba Kikai Kabushiki Kaisha
- 当前专利权人： Toshiba Kikai Kabushiki Kaisha
- 当前专利权人地址： JP Tokyo
- 代理机构： Pillsbury Winthrop Shaw Pittman LLP
- 优先权： JP2002-107215 20020409
- 主分类号： B29C45/66
- IPC分类号： B29C45/66 ; B29C45/76 ; B29C45/64
摘要：
Method for mold clamping of the present invention is capable of shortening a molding cycle without any initial setting works for an engaging position of a tie bars. The method is constituted the steps of moving the tie bars in the direction of mold closing during mold close operation, judging a relative moving speed between a movable die plate and the tie bar to be within a predetermined value, engaging the tie bars with the movable die plate mechanically by operating an engaging means when the relative moving speed is judged to be within the value, then further moving the movable die plate against a fixed die plate under engagement, and after contact of a movable mold with a fixed mold driving a mold clamping cylinder, thereby executing mold clamping operation.