Invention Grant
- Patent Title: Printable substrate having controllable thickness and method of making and using the same
- Patent Title (中): 具有可控厚度的可印刷基板及其制造和使用方法
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Application No.: US10010573Application Date: 2001-11-13
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Publication No.: US06937358B2Publication Date: 2005-08-30
- Inventor: William A. Sullivan , Michael L. Weiner
- Applicant: William A. Sullivan , Michael L. Weiner
- Applicant Address: US NY West Henrietta
- Assignee: Technology Innovations, LLC
- Current Assignee: Technology Innovations, LLC
- Current Assignee Address: US NY West Henrietta
- Agency: Basch & Nickerson LLP
- Agent Duane C. Basch
- Main IPC: B41J11/00
- IPC: B41J11/00 ; G03G15/00 ; G06F15/00
Abstract:
The present invention is a method and an apparatus for controlling the volume of a printable substrate after an image is created thereon, and more particularly to the production and use of a calenderizeable substrate in which a final thickness may be adjusted. The system employed for the process includes a pair of compression rollers wherein the nip force therebetween may be adjusted.
Public/Granted literature
- US20020071701A1 Printable substrate having controllable thickness and method of making and using the same Public/Granted day:2002-06-13
Information query
IPC分类:
