Invention Grant
- Patent Title: Fluid injection head structure
- Patent Title (中): 流体注射头结构
-
Application No.: US10604223Application Date: 2003-07-01
-
Publication No.: US06938993B2Publication Date: 2005-09-06
- Inventor: Tsung-Wei Huang , Chih-Ching Chen
- Applicant: Tsung-Wei Huang , Chih-Ching Chen
- Applicant Address: TW Tao-Yuan Hsien
- Assignee: BENQ Corporation
- Current Assignee: BENQ Corporation
- Current Assignee Address: TW Tao-Yuan Hsien
- Agent Winston Hsu
- Main IPC: B41J2/05
- IPC: B41J2/05 ; B41J2/14 ; B41J2/16

Abstract:
A fluid injection head structure. The fluid injection head structure is formed on a substrate and has a manifold therein, bubble generators, a conductive trace, and at least two rows of chambers adjacent to the manifold in flow communication with the manifold. The conductive trace disposed on a top surface of the substrate and partially disposed between the two rows of the chambers above the manifold is used to drive the bubble generator.
Public/Granted literature
- US20040104973A1 FLUID INJECTION HEAD STRUCTURE Public/Granted day:2004-06-03
Information query
IPC分类: