发明授权
- 专利标题： Semiconductor package and method of preparing same
- 专利标题（中）： 半导体封装及其制备方法
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申请号： US10068755申请日： 2002-05-16
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公开(公告)号： US06940177B2公开(公告)日： 2005-09-06
- 发明人: Stanton James Dent , Lyndon James Larson , Robert Thomas Nelson , Debra Charilla Rash
- 申请人： Stanton James Dent , Lyndon James Larson , Robert Thomas Nelson , Debra Charilla Rash
- 申请人地址： US MI Midland
- 专利权人： Dow Corning Corporation
- 当前专利权人： Dow Corning Corporation
- 当前专利权人地址： US MI Midland
- 代理商 Catherine U. Brown
- 主分类号： C08L83/05
- IPC分类号： C08L83/05 ; C08L83/07 ; H01L21/60 ; H01L21/768 ; H01L23/29 ; H01L23/31 ; H01L23/485 ; H01L23/532 ; H01L23/48
摘要：
A semiconductor package comprising a semiconductor wafer having an active surface comprising at least one integrated circuit, wherein each integrated circuit has a plurality of bond pads; and at least one cured silicone member covering at least a portion of the active surface, wherein at least a portion of each bond pad is not covered by the silicone member, the silicone member has a coefficient of linear thermal expansion of from 60 to 280 μm/m° C. between −40 and 150° C. and a modulus of from 1 to 300 MPa at 25° C., and the silicone member is prepared by the method of the invention.
公开/授权文献
- US20030214051A1 Semiconductor package and method of preparing same 公开/授权日：2003-11-20
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