发明授权
US06943045B2 Semiconductor wafer protective device and semiconductor wafer treatment method
有权
半导体晶片保护器件和半导体晶片处理方法
- 专利标题： Semiconductor wafer protective device and semiconductor wafer treatment method
- 专利标题（中）： 半导体晶片保护器件和半导体晶片处理方法
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申请号： US10468452申请日： 2003-02-27
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公开(公告)号： US06943045B2公开(公告)日： 2005-09-13
- 发明人: Masahiko Kitamura , Masatoshi Nanjo , Kouichi Yajima , Shinichi Namioka
- 申请人： Masahiko Kitamura , Masatoshi Nanjo , Kouichi Yajima , Shinichi Namioka
- 申请人地址： JP Tokyo
- 专利权人： Disco Corporation
- 当前专利权人： Disco Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Smith, Gambrell & Russell, LLP
- 优先权： JP2002-304454 20021018
- 国际申请： PCT/JP03/02194 WO 20030227
- 国际公布： WO2004/036 WO 20040429
- 主分类号： H01L21/683
- IPC分类号： H01L21/683 ; B24B7/22 ; H01L21/00 ; H01L21/02 ; H01L21/301 ; H01L21/68 ; H01L21/66
摘要：
A semiconductor wafer protecting unit which enables a semiconductor wafer to be handled as required, without breakage of the semiconductor wafer, even when the back of the semiconductor wafer is ground to decrease the thickness of the semiconductor wafer markedly; and a semiconductor wafer processing method using such a semiconductor wafer protecting unit. The semiconductor wafer protecting unit is composed of a magnetized tape having one surface with tackiness, and a magnetic substrate having many pores formed at least in a central zone thereof.
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