Invention Grant
- Patent Title: EMI-attenuating air ventilation panel
- Patent Title (中): EMI减弱通风面板
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Application No.: US10618399Application Date: 2003-07-11
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Publication No.: US06947294B2Publication Date: 2005-09-20
- Inventor: Yun Hsu Lin , Shang Tsang Yeh , Wei Li , XiaoWei Li
- Applicant: Yun Hsu Lin , Shang Tsang Yeh , Wei Li , XiaoWei Li
- Applicant Address: TW Taipei Hsien
- Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee Address: TW Taipei Hsien
- Agent Wei Te Chung
- Priority: TW92209563 20030523
- Main IPC: H05K9/00
- IPC: H05K9/00 ; H01J5/00 ; H01J15/00 ; H02G3/08 ; H05K5/00

Abstract:
An EMI-attenuating air ventilation panel (10, 30) for an electronic device enclosure (100) in accordance with present invention includes an electronically conductive base plate (16) and a plurality of vents (12, 14, 32) defined in the base plate for forming a vents array. Each vent has extruded sidewalls (120, 140, 31) extending from sides therein. In use, the EMI from electronic components within the electronic device enclosure is efficiently attenuated by the sidewalls.
Public/Granted literature
- US20040233654A1 EMI-attenuating air ventilation panel Public/Granted day:2004-11-25
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