A MEMS device is disclosed comprising: a substrate; a movable micromechanical element movable relative to the substrate; a connector and a hinge for allowing movement of the micromechanical element, wherein the connector is made of a material different than the hinge. In another embodiment of the invention, the connector has a conductivity greater than the hinge. In a further embodiment of the invention, the hinge provides at least 90% of the restoring force to the MEMS device, and the connector provides 10% or less of the restoring force. In a further embodiment of the invention, the connector and the hinge have different spring constants. In a still further embodiment of the invention, the connector experiences a lower strain at maximum deflection of the micromechanical element than the hinge.