发明授权
- 专利标题: Laminate with a peelable top layer and method of peeling off the top layer from the laminate
- 专利标题(中): 具有可剥离顶层的层压板和从顶层剥离顶层的方法
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申请号: US10885735申请日: 2004-07-08
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公开(公告)号: US06951677B2公开(公告)日: 2005-10-04
- 发明人: Hiroyuki Ishikawa , Sumiya Shimotsuma , Shinichiro Matsushita , Keiichi Hamada
- 申请人: Hiroyuki Ishikawa , Sumiya Shimotsuma , Shinichiro Matsushita , Keiichi Hamada
- 申请人地址: JP Osaka JP Osaka
- 专利权人: Matsushita Electric Works, Ltd.,Konishi Co., Ltd.
- 当前专利权人: Matsushita Electric Works, Ltd.,Konishi Co., Ltd.
- 当前专利权人地址: JP Osaka JP Osaka
- 代理机构: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- 优先权: JP2000-323254 20001023; JP2000-323255 20001023
- 主分类号: B32B33/00
- IPC分类号: B32B33/00 ; B32B7/06 ; B32B7/12 ; B32B5/16 ; C08J3/00 ; C09J7/02
摘要:
A laminate with a peelable top layer is provided. The laminate comprises a substrate such as a porous board, the top layer such as a plastic top layer or a decorated metal plate, and a bonding layer between the top layer and the substrate. At least one of the substrate and the top layer is porous. An adhesive for forming the bonding layer comprises (A) an aqueous dispersion containing a polymer, which demonstrates properties that a dried film of the aqueous dispersion has a tensile strength of 1 to 28 MPa and a percentage elongation of 100 to 2000%, and (B) a water-based adhesive composition containing microspheres with thermal expansion capability, each of which is composed of a polymer shell encapsulating a gas. By use of this adhesive, the bonding layer provides a high bonding strength between the top layer and the substrate. When irradiating the laminate with ultraviolet or far infrared, while heating, the top layer can be easily peeled off from the laminate.
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