发明授权
- 专利标题： Electronic and optoelectronic component packaging technique
- 专利标题（中）： 电子和光电元件封装技术
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申请号： US10460852申请日： 2003-06-13
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公开(公告)号： US06952046B2公开(公告)日： 2005-10-04
- 发明人: Brian Farrell , Paul Jaynes , Malcolm Taylor
- 申请人： Brian Farrell , Paul Jaynes , Malcolm Taylor
- 申请人地址： US MA Waltham
- 专利权人： Foster-Miller, Inc.
- 当前专利权人： Foster-Miller, Inc.
- 当前专利权人地址： US MA Waltham
- 代理机构： Iandiorio & Teska
- 主分类号： H01L21/50
- IPC分类号： H01L21/50 ; H01L23/04 ; H01L23/06 ; H01L23/10 ; H01L23/02
摘要：
A package including a substrate, a plurality of components on the substrate, and a lid assembly including a plurality of integrated covers for at least select components on the substrate. A method of manufacturing such a lid assembly is also disclosed as is a packaging method.
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