发明授权
- 专利标题: Single tool defect classification solution
- 专利标题(中): 单刀缺陷分类解决方案
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申请号: US10705059申请日: 2003-11-10
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公开(公告)号: US06952653B2公开(公告)日: 2005-10-04
- 发明人: Gabor D. Toth , David R. Bakker
- 申请人: Gabor D. Toth , David R. Bakker
- 申请人地址: US CA Milpitas
- 专利权人: KLA-Tencor Technologies Corporation
- 当前专利权人: KLA-Tencor Technologies Corporation
- 当前专利权人地址: US CA Milpitas
- 代理机构: Beyer, Weaver & Thomas, LLP.
- 主分类号: G01N21/95
- IPC分类号: G01N21/95 ; G06T7/00 ; G01B5/28 ; G06K9/00
摘要:
Methods and apparatus for efficiently analyzing defects in-line on a wafer by wafer basis are provided. In general terms, embodiments of the present invention provide a simple interface for setting up the entire inspection and defect analysis process in a single set up procedure. The apparatus includes an inspection station for inspecting a specimen for potential defects and a review station for analyzing a sample of the potential defects to determine a classification of such potential defects. The apparatus further includes a computer system having an application interface operable to allow a user to set up the inspection station and the review station during a same setup phase so as to allow the inspection station and the review station to then operate automatically to provide defect information for one or more specimens based on the user set up.
公开/授权文献
- US20050033528A1 Single tool defect classification solution 公开/授权日:2005-02-10
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