Invention Grant
- Patent Title: Protective film for FPD, vapor deposition material for protective film and its production method, FPD, and manufacturing device for FPD protective film
- Patent Title (中): FPD保护膜，保护膜用蒸镀材料及其制作方法，FPD及FPD保护膜制造装置
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Application No.: US10642618Application Date: 2003-08-19
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Publication No.: US06965125B2Publication Date: 2005-11-15
- Inventor: Hideaki Sakurai , Yoshirou Kuromitsu
- Applicant: Hideaki Sakurai , Yoshirou Kuromitsu
- Applicant Address: JP Tokyo
- Assignee: Mitsusbishi Materials Corporation
- Current Assignee: Mitsusbishi Materials Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- Priority: JPP2000-210667 20000712; JPP2000-302404 20001002; JPP2001-016910 20010125; JPP2001-163910 20010531
- Main IPC: H01J17/02
- IPC: H01J17/02 ; C03C17/22 ; C03C17/34 ; C04B35/01 ; C04B35/03 ; C04B35/057 ; C04B35/50 ; C04B35/505 ; C04B35/553 ; C04B41/50 ; C04B41/85 ; C23C14/06 ; C23C14/24 ; H01J9/20 ; H01L27/15
Abstract:
A vapor deposited material for FPD protective film comprises a polycrystalline body, sintered body, or single crystal having a surface covered with a fluoride layer. A manufacturing device for FPD protective film comprises: a film formation section for forming a film body on one side of a substrate, and a layer formation section for forming a fluoride layer on a surface of said film body; wherein said layer formation section comprises: a layer formation chamber for housing a substrate on which said film body is formed, a gas supply mechanism for forming a fluoride layer on the surface of said film body by supplying a fluoridation agent towards said substrate in said layer formation chamber, and a substrate heating section provided in said layer formation chamber for heating said substrate.
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