发明授权
US06967174B1 Wafer chuck for use in edge bevel removal of copper from silicon wafers
有权
用于从硅晶片去除铜的边缘斜面的晶片卡盘
- 专利标题: Wafer chuck for use in edge bevel removal of copper from silicon wafers
- 专利标题(中): 用于从硅晶片去除铜的边缘斜面的晶片卡盘
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申请号: US10357999申请日: 2003-02-03
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公开(公告)号: US06967174B1公开(公告)日: 2005-11-22
- 发明人: Steven T. Mayer , Steve Taatjes , Andy McCutcheon , Jim Schall , Jingbin Feng
- 申请人: Steven T. Mayer , Steve Taatjes , Andy McCutcheon , Jim Schall , Jingbin Feng
- 申请人地址: US CA San Jose
- 专利权人: Novellus Systems, Inc.
- 当前专利权人: Novellus Systems, Inc.
- 当前专利权人地址: US CA San Jose
- 代理机构: Beyer, Weaver & Thomas LLP
- 主分类号: H01L21/00
- IPC分类号: H01L21/00 ; H01L21/302
摘要:
A wafer chuck includes alignment members that allows a semiconductor wafer to be properly aligned on the chuck without using a separate alignment stage. The alignment members may be cams, for example, attached to arms of the wafer chuck. These members may assume an alignment position when a robot arm places the wafer on the chuck. In this position, they guide the wafer into a proper alignment position with respect to the chuck. During rotation at a particular rotational speed, the alignment members move away from the wafer to allow liquid etchant to flow over the entire edge region of the wafer. At still higher rotational speeds, the wafer is clamped into position to prevent it from flying off the chuck. A clamping cam or other device (such as the alignment member itself) may provide the clamping.