发明授权
- 专利标题： Terahertz interconnect system and applications
- 专利标题（中）： 太赫兹互连系统和应用
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申请号： US10462491申请日： 2003-06-14
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公开(公告)号： US06967347B2公开(公告)日： 2005-11-22
- 发明人: Michael J. Estes , Garret Moddel
- 申请人： Michael J. Estes , Garret Moddel
- 申请人地址： US CO Boulder
- 专利权人： The Regents of the University of Colorado
- 当前专利权人： The Regents of the University of Colorado
- 当前专利权人地址： US CO Boulder
- 代理商 Michael Pritekau; Yoriko Morita
- 主分类号： G02B6/122
- IPC分类号： G02B6/122 ; G02B6/42 ; G11C7/00 ; H01L23/48 ; H01L31/0336 ; H01L31/336
摘要：
An assembly includes a first electrical circuitry for providing a first electrical signal containing data and a transmitting arrangement, connected with the first electrical circuitry, for receiving the first electrical signal and for converting the first electrical signal into an electromagnetic signal containing at least a portion of the data. The electromagnetic signal has a carrier frequency greater than 300 GHz. The assembly also includes a receiving arrangement for receiving the electromagnetic signal and for converting the electromagnetic signal into a second electrical signal containing at least some of the portion of the data, and a second electrical circuitry connected with the receiving arrangement and configured for receiving the second electrical signal.
公开/授权文献
- US20040069984A1 Terahertz interconnect system and applications 公开/授权日：2004-04-15