发明授权
- 专利标题: Method and apparatus for amplifying capacitively coupled inter-chip communication signals
- 专利标题(中): 用于放大电容耦合芯片间通信信号的方法和装置
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申请号: US10772106申请日: 2004-02-03
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公开(公告)号: US06972596B1公开(公告)日: 2005-12-06
- 发明人: Robert Proebsting , Robert J. Bosnyak
- 申请人: Robert Proebsting , Robert J. Bosnyak
- 申请人地址: US CA Santa Clara
- 专利权人: Sun Microsystems, Inc.
- 当前专利权人: Sun Microsystems, Inc.
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Park, Vaughan & Fleming, LLP
- 主分类号: H03K5/003
- IPC分类号: H03K5/003 ; H03K19/094
摘要:
One embodiment of the present invention provides a system that amplifies capacitively coupled inter-chip communication signals. During operation, the system transmits a signal through a capacitive transmitter pad and receives a corresponding input signal through a capacitive receiver pad. The system amplifies the input signal by feeding it through a number of cascaded CMOS inverters operating from ever-increasing power supply voltages from the first to the last inverter. The system periodically initializes the input voltage of the first CMOS inverter by: suspending data transmission on the capacitive transmitter pad and setting the voltage on the capacitive transmitter pad to a middle point between a voltage that represents logic “1” and a voltage that represents logic “0”, coupling the output of the first CMOS inverter to its input through a switch, and, after the input voltage of the first CMOS inverter stage substantially stabilizes at the switching threshold, uncoupling the output of the first CMOS inverter stage from the input of the first CMOS inverter stage and then resuming data transmission on the capacitive transmitter pad.
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