发明授权
- 专利标题: Microprocessing apparatus, semiconductor device manufacturing apparatus, and device manufacturing method
- 专利标题(中): 微处理装置,半导体装置制造装置及装置的制造方法
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申请号: US10951957申请日: 2004-09-28
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公开(公告)号: US06972844B2公开(公告)日: 2005-12-06
- 发明人: Toshinobu Tokita
- 申请人: Toshinobu Tokita
- 申请人地址: JP Tokyo
- 专利权人: Canon Kabushiki Kaisha
- 当前专利权人: Canon Kabushiki Kaisha
- 当前专利权人地址: JP Tokyo
- 代理机构: Morgan & Finnegan, L.L.P.
- 优先权: JP2003-337561 20030929
- 主分类号: G03F7/20
- IPC分类号: G03F7/20 ; G03F9/00 ; H01L21/027 ; G01B11/00 ; B29C59/16 ; B44C1/22 ; G01B15/00
摘要:
An illustrative object of the present invention is to provide a microprocessing apparatus by which an original and a substrate to be processed can be aligned with each other with a higher precision. Disclosed in this connection is an apparatus for transferring a pattern of an original onto a substrate while maintaining the original and the substrate in contact with each other or in close proximity to each other, wherein the apparatus includes an original holding device for holding the original, a substrate holding device for holding the substrate, a reference mark, and a position measuring system for measuring a relative positional relationship between the reference mark and a mark formed on at least one of the original and the substrate.
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