Invention Grant
- Patent Title: Method and system for controlling ion distribution during plating of a metal on a workpiece surface
- Patent Title (中): 在工件表面镀金属时控制离子分布的方法和系统
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Application No.: US10358969Application Date: 2003-02-05
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Publication No.: US06974530B2Publication Date: 2005-12-13
- Inventor: Matthias Bonkass , Axel Preusse
- Applicant: Matthias Bonkass , Axel Preusse
- Applicant Address: US TX Austin
- Assignee: Advanced Micro Devices, Inc.
- Current Assignee: Advanced Micro Devices, Inc.
- Current Assignee Address: US TX Austin
- Agency: Williams, Morgan & Amerson, P.C.
- Priority: DE10229001 20020628
- Main IPC: C25D5/00
- IPC: C25D5/00 ; C25D5/02 ; C25D7/12 ; C25D17/00 ; C26D7/00

Abstract:
The flow of electrolyte and/or of ions is controlled by a diffuser element provided in a plating reactor, wherein, in one embodiment, the diffuser element comprises a mechanical adjustment mechanism to adjust the effective size of passages of the diffuser element. In another embodiment, the diffuser element comprises at least two patterns of passages that are movable relatively to each other so as to adjust an overlap and thus an effective size of the corresponding passages. Moreover, the path of ions within the plating reactor may be controlled by an electromagnetically driven diffuser element so that a required thickness profile on the workpiece surface may be obtained.
Public/Granted literature
- US20040000487A1 Method and system for controlling ion distribution during plating of a metal on a workpiece surface Public/Granted day:2004-01-01
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