- 专利标题： Chip package sealing method
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申请号： US10460942申请日： 2003-06-13
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公开(公告)号： US06977187B2公开(公告)日： 2005-12-20
- 发明人: Brian Farrell , Paul Jaynes , Malcolm Taylor
- 申请人： Brian Farrell , Paul Jaynes , Malcolm Taylor
- 申请人地址： US MA Waltham
- 专利权人： Foster-Miller, Inc.
- 当前专利权人： Foster-Miller, Inc.
- 当前专利权人地址： US MA Waltham
- 代理机构： Iandiorio & Teska
- 主分类号： H01L21/50
- IPC分类号： H01L21/50 ; H01L23/04 ; H01L23/06 ; H01L23/10 ; H01L21/00
摘要：
A method of manufacturing a package including manufacturing a substrate to include at least one layer of LCP material, manufacturing a cover made of LCP material to include a lower lip, and sealing the cover to the substrate by heating the interface between the lower lip and the substrate.
公开/授权文献
- US20040010910A1 Chip package sealing method 公开/授权日：2004-01-22
信息查询
IPC分类:
