发明授权
- 专利标题： Heat-sensitive material and heat-sensitive element
- 专利标题（中）： 热敏材料和热敏元件
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申请号： US09861319申请日： 2001-05-17
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公开(公告)号： US06977343B2公开(公告)日： 2005-12-20
- 发明人: Kazutaka Furuta , Norikazu Iwasaki
- 申请人： Kazutaka Furuta , Norikazu Iwasaki
- 申请人地址： JP Tokyo JP Tokyo
- 专利权人： Sony Corporation,Sony Chemicals Corporation
- 当前专利权人： Sony Corporation,Sony Chemicals Corporation
- 当前专利权人地址： JP Tokyo JP Tokyo
- 代理机构： Hogan & Hartson L.L.P.
- 优先权： JPP.2000-147061 20000518
- 主分类号： H01C7/04
- IPC分类号： H01C7/04 ; H01M2/34 ; H01M6/50 ; H01M10/0525 ; H01M10/42 ; H02G3/00
摘要：
The invention provides a heat-sensitive material having a heat shrinkable material (e.g., a heat shrinkable resin) having dispersed therein electrically conductive particles, which shrinks on heating to allow an electric current to flow. The invention also provides a heat-sensitive element having a heat-sensitive material and a pair of electrode terminals which are useful as an over-charge protective element of lithium ion secondary batteries.
公开/授权文献
- US20010043138A1 Heat-sensitive material and heat-sensitive element 公开/授权日：2001-11-22
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