Invention Grant
- Patent Title: Foot pad
- Patent Title (中): 足垫
-
Application No.: US10815758Application Date: 2004-04-02
-
Publication No.: US06979778B2Publication Date: 2005-12-27
- Inventor: Roger Xiong , Chi-Ren Hsueh
- Applicant: Roger Xiong , Chi-Ren Hsueh
- Applicant Address: TW Taipei
- Assignee: Lite-On Technology Corporation
- Current Assignee: Lite-On Technology Corporation
- Current Assignee Address: TW Taipei
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: A47B91/04
- IPC: A47B91/04 ; H01J15/00 ; H02G3/08 ; H05K5/02

Abstract:
A foot pad has an elastic conical body and at least one elastic rib. The elastic conical body defines a connecting surface and an outer conical surface. The connecting surface defines a hollow portion, and the elastic rib integrally connects to the elastic conical body at a surface of the hollow portion. The outer conical surface has a root portion connecting with an outer edge of the connecting surface. A thickness of the elastic conical body at the root portion of the outer conical surface is greater than a thickness of the elastic conical body at other portions of the outer conical surface. Elasticity of the foot pad is thereby increased so as to enlarge a contact area contacting an outer supporting surface, so that an anti-skid effect is improved and the foot pad is capable of absorbing a deformation of an electronic product.
Public/Granted literature
- US20050217879A1 FOOT PAD Public/Granted day:2005-10-06
Information query