发明授权
US06981317B1 Method and device for mounting electronic component on circuit board
失效
将电子元件安装在电路板上的方法和装置
- 专利标题： Method and device for mounting electronic component on circuit board
- 专利标题（中）： 将电子元件安装在电路板上的方法和装置
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申请号： US09331763申请日： 1997-12-26
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公开(公告)号： US06981317B1公开(公告)日： 2006-01-03
- 发明人: Kazuto Nishida
- 申请人： Kazuto Nishida
- 申请人地址： JP Osaka-fu
- 专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址： JP Osaka-fu
- 代理机构： Wenderoth, Lind & Ponack, L.L.P.
- 优先权： JP8-350738 19961227
- 国际申请： PCT/JP97/04873 WO 19971226
- 国际公布： WO98/30073 WO 19980709
- 主分类号： H01L21/44
- IPC分类号： H01L21/44
摘要：
When mounting an IC chip on a circuit board, bumps are formed on electrodes of the IC chip, and the bumps and the electrodes of the circuit board are aligned in position with each other with interposition of an insulative thermosetting resin having no conductive particle between the electrodes of the circuit board and the bumps. The IC chip is pressed against the circuit board with a pressure force of not smaller than 20 gf per bump by a heated head so as to perform warp correction of the IC chip and the board, while the resin interposed between the IC chip and the circuit board is hardened to bond the IC chip and the circuit board together.
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