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发明授权
US06982380B2 Encapsulated component which is small in terms of height and method for producing the same 有权
高度小的密封部件及其制造方法

Encapsulated component which is small in terms of height and method for producing the same
摘要：
For simpler and safer encapsulation of components, it is proposed to generate the connection between a chip and a carrier substrate by means of bump connections that are sunk into recesses on the carrier substrate. The component thereby lies directly on the carrier substrate, in particular on a frame circumscribing the component structures on the chip.
摘要（中）：

为了更简单和更安全地封装组件，建议通过沉积在载体衬底上的凹陷中的凸块连接来产生芯片和载体衬底之间的连接。 因此，该部件直接位于载体基板上，特别是在限定芯片上的部件结构的框架上。

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