发明授权
US06984076B2 Compact package design for vertical cavity surface emitting laser array to optical fiber cable connection
有权
紧凑型封装设计，用于垂直腔表面发射激光器阵列到光纤电缆连接
- 专利标题： Compact package design for vertical cavity surface emitting laser array to optical fiber cable connection
- 专利标题（中）： 紧凑型封装设计，用于垂直腔表面发射激光器阵列到光纤电缆连接
-
申请号： US10680201申请日： 2003-10-08
-
公开(公告)号： US06984076B2公开(公告)日： 2006-01-10
- 发明人: Harold Y. Walker, Jr. , Klein L. Johnson , Yue Liu , Bo Su Chen
- 申请人： Harold Y. Walker, Jr. , Klein L. Johnson , Yue Liu , Bo Su Chen
- 申请人地址： US NJ Morristown
- 专利权人： Honeywell International Inc.
- 当前专利权人： Honeywell International Inc.
- 当前专利权人地址： US NJ Morristown
- 代理机构： McKenna Long & Aldridge
- 主分类号： H01S3/04
- IPC分类号： H01S3/04
摘要：
A housing for opto-electronic array devices. The housing includes a base and walls that form a region that receives an opto-electronic semiconductor array. Conductive traces are disposed on a wall such that a front part of the traces are exposed for external electrical connections, while the back part is exposed for internal electrical connections. A transparent substrate having a plurality of micro-lenses cover the base, walls and opto-electronic semiconductor array device. Each micro lens is beneficially made from optical epoxy that is deposited by an ink-jet nozzle. The base and walls are beneficially comprised of a ceramic.