发明授权
US06984076B2 Compact package design for vertical cavity surface emitting laser array to optical fiber cable connection 有权
紧凑型封装设计,用于垂直腔表面发射激光器阵列到光纤电缆连接

Compact package design for vertical cavity surface emitting laser array to optical fiber cable connection
摘要:
A housing for opto-electronic array devices. The housing includes a base and walls that form a region that receives an opto-electronic semiconductor array. Conductive traces are disposed on a wall such that a front part of the traces are exposed for external electrical connections, while the back part is exposed for internal electrical connections. A transparent substrate having a plurality of micro-lenses cover the base, walls and opto-electronic semiconductor array device. Each micro lens is beneficially made from optical epoxy that is deposited by an ink-jet nozzle. The base and walls are beneficially comprised of a ceramic.
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