发明授权
US06984076B2 Compact package design for vertical cavity surface emitting laser array to optical fiber cable connection
有权
紧凑型封装设计,用于垂直腔表面发射激光器阵列到光纤电缆连接
- 专利标题: Compact package design for vertical cavity surface emitting laser array to optical fiber cable connection
- 专利标题(中): 紧凑型封装设计,用于垂直腔表面发射激光器阵列到光纤电缆连接
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申请号: US10680201申请日: 2003-10-08
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公开(公告)号: US06984076B2公开(公告)日: 2006-01-10
- 发明人: Harold Y. Walker, Jr. , Klein L. Johnson , Yue Liu , Bo Su Chen
- 申请人: Harold Y. Walker, Jr. , Klein L. Johnson , Yue Liu , Bo Su Chen
- 申请人地址: US NJ Morristown
- 专利权人: Honeywell International Inc.
- 当前专利权人: Honeywell International Inc.
- 当前专利权人地址: US NJ Morristown
- 代理机构: McKenna Long & Aldridge
- 主分类号: H01S3/04
- IPC分类号: H01S3/04
摘要:
A housing for opto-electronic array devices. The housing includes a base and walls that form a region that receives an opto-electronic semiconductor array. Conductive traces are disposed on a wall such that a front part of the traces are exposed for external electrical connections, while the back part is exposed for internal electrical connections. A transparent substrate having a plurality of micro-lenses cover the base, walls and opto-electronic semiconductor array device. Each micro lens is beneficially made from optical epoxy that is deposited by an ink-jet nozzle. The base and walls are beneficially comprised of a ceramic.
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