发明授权
- 专利标题: Bond enhancement for thermally insulated ceramic matrix composite materials
- 专利标题(中): 绝缘陶瓷基复合材料的粘结强化
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申请号: US10631277申请日: 2003-07-31
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公开(公告)号: US06984277B2公开(公告)日: 2006-01-10
- 发明人: Jay Alan Morrison , Gary Brian Merrill , Thomas Barrett Jackson
- 申请人: Jay Alan Morrison , Gary Brian Merrill , Thomas Barrett Jackson
- 申请人地址: US FL Orlando
- 专利权人: Siemens Westinghouse Power Corporation
- 当前专利权人: Siemens Westinghouse Power Corporation
- 当前专利权人地址: US FL Orlando
- 主分类号: B32B31/10
- IPC分类号: B32B31/10 ; B32B31/12
摘要:
A composite structure (62) having a bond enhancement member (76) extending across a bond joint (86) between a ceramic matrix composite (CMC) material (80) and a ceramic insulation material (82), and a method of fabricating such a structure. The bond enhancement member may extend completely through the CMC material to be partially embedded in a core material (84) bonded to the CMC material on an opposed side from the insulation material. A mold (26) formed of a fugitive material having particles (18) of a bond enhancement material may be used to form the CMC material. A two-piece mold (38, 46) may be used to drive a bond enhancement member partially into the CMC material. A compressible material (56) containing the bond enhancement member may be compressed between a hard tool (60) and the CMC material to drive a bond enhancement member partially into the CMC material. A surface (98) of a ceramic insulation material (92) having a bond enhancement member (96) extending therefrom may be used as a mold for laying up a CMC material.
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