Invention Grant
- Patent Title: Method of fabricating a MRAM device
- Patent Title (中): 制造MRAM器件的方法
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Application No.: US10811553Application Date: 2004-03-29
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Publication No.: US06984530B2Publication Date: 2006-01-10
- Inventor: Heon Lee , Thomas C. Anthony , Manish Sharma
- Applicant: Heon Lee , Thomas C. Anthony , Manish Sharma
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A method of fabricating a magnetic random access memory (MRAM) device is disclosed. The method reduces the number of mask steps and processing steps required to fabricate the MRAM device. A first conductive layer and a sense layer are patterned in a first mask step. A subsequent etching step forms a bottom electrode and a sense layer that are continuous with each other in a first direction. A second conductive layer and a plurality of layers of material required to form a magnetic tunnel junction stack are patterned in a second mask step. A subsequent etching step forms a top electrode and a plurality of layers of material that are continuous with each other in a second direction, and a plurality of discrete sense layers. The discrete sense layers and the plurality of layers of material define a plurality of magnetic tunnel junction devices.
Public/Granted literature
- US20050214953A1 METHOD OF FABRICATING A MRAM DEVICE Public/Granted day:2005-09-29
Information query
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