发明授权
US06986199B2 Laser-based technique for producing and embedding electrochemical cells and electronic components directly into circuit board materials
有权
基于激光的技术，用于将电化学电池和电子部件直接生产和嵌入到电路板材料中
- 专利标题： Laser-based technique for producing and embedding electrochemical cells and electronic components directly into circuit board materials
- 专利标题（中）： 基于激光的技术，用于将电化学电池和电子部件直接生产和嵌入到电路板材料中
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申请号： US10868448申请日： 2004-06-09
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公开(公告)号： US06986199B2公开(公告)日： 2006-01-17
- 发明人: Craig B. Arnold , Alberto Pique , Ray Auyeung , Michael Nurnberger
- 申请人： Craig B. Arnold , Alberto Pique , Ray Auyeung , Michael Nurnberger
- 申请人地址： US DC Washington
- 专利权人： The United States of America as represented by the Secretary of the Navy
- 当前专利权人： The United States of America as represented by the Secretary of the Navy
- 当前专利权人地址： US DC Washington
- 代理商 John J. Karasek; Joseph T. Grunkemeyer
- 主分类号： H01R43/00
- IPC分类号： H01R43/00
摘要：
A method is provided for embedding electronic components including electrochemical cells within a circuit board substrate. The method includes micromachining the printed circuit board substrate to a selective depth to form a recess. A component is inserted into the recess and an electrical connection is established between the electrical component and a metallized pattern of the circuit board substrate using, e.g., laser direct-write.
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