Invention Grant
- Patent Title: Method and system for cooling electronic components
- Patent Title (中): 冷却电子元件的方法和系统
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Application No.: US10602972Application Date: 2003-06-23
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Publication No.: US06987370B2Publication Date: 2006-01-17
- Inventor: Sachin Navin Chheda , Stephan Karl Barsun , Ricardo E. Epinoza-Ibarra
- Applicant: Sachin Navin Chheda , Stephan Karl Barsun , Ricardo E. Epinoza-Ibarra
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: H02P1/00
- IPC: H02P1/00
Abstract:
A localized system for dissipating heat generated by an electronic component includes a controllable cooling element and a control system for controlling the cooling element. The control system adjusts a speed of operation of the cooling element in response to variations in power consumption of the electronic component.
Public/Granted literature
- US20040257013A1 Method and system for cooling electronic components Public/Granted day:2004-12-23
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