An electrical feedthrough assembly for establishing an electrical connection path through an aperture in a side wall of a housing, and a method of fabrication thereof. The feedthrough assembly comprises a plate and at least one electrical contact which extends through the plate. Preferably, a heating member is further provided to extend along a circumference of the plate. The plate is sized to span and surround the aperture so that, upon generation of heat by the heating member, at least one ring of sealing material adjacent the heating member flows to establish a seal between the plate and the housing wall surrounding the aperture. The heat is preferably generated by applying current to the heating member. The feedthrough assembly is preferably fabricated using a microfabrication process. A batch fabrication operation is preferably employed so that a population of the plates are formed from a single panel and subsequently separated therefrom.