发明授权
- 专利标题: Solid electrolytic capacitor, circuit board having built-in solid electrolytic capacitor and methods for manufacturing them
- 专利标题(中): 固体电解电容器,内置固体电解电容器的电路板及其制造方法
-
申请号: US10518683申请日: 2003-06-18
-
公开(公告)号: US06989982B2公开(公告)日: 2006-01-24
- 发明人: Masaaki Kobayashi , Masaaki Togashi
- 申请人: Masaaki Kobayashi , Masaaki Togashi
- 申请人地址: JP Tokyo
- 专利权人: TDK Corporation
- 当前专利权人: TDK Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Seed IP Law Group PLLC
- 优先权: JP2002-177546 20020618; JP2002-177547 20020618
- 国际申请: PCT/JP03/07733 WO 20030618
- 国际公布: WO03/107367 WO 20031224
- 主分类号: H01G9/00
- IPC分类号: H01G9/00
摘要:
An electrode body 100 of a solid electrolytic capacitor component includes a foil-like aluminum substrate 2 whose surface is roughened or enlarged and which is formed with an aluminum oxide film the surface thereof as an insulating oxide film, two foil-like aluminum substrates 3a,3b whose surfaces are not roughened, and two foil-like copper substrates 4a,4b as a metal electric conductor for constituting a lead electrode. On the whole surface of the foil-like aluminum substrate 2, an anode electrode 14 including a solid high molecular polymer electrolyte layer 11, a graphite paste layer 12 and a silver paste layer 13 is formed. The thus constituted solid electrolytic capacitor component 110 is accommodated in a substantially closed space defined by a first insulating substrate 21 and a second insulating substrate 22, thereby fabricating a three-terminal type solid electrolytic capacitor.
公开/授权文献
信息查询