发明授权
- 专利标题： Magnetic head grinding device and method
- 专利标题（中）： 磁头研磨装置及方法
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申请号： US10311207申请日： 2001-06-15
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公开(公告)号： US06991513B2公开(公告)日： 2006-01-31
- 发明人: Kazushige Tohta , Hiroshi Shindo , Akio Ogawa , Osamu Fukuroi , Takashi Fujii
- 申请人： Kazushige Tohta , Hiroshi Shindo , Akio Ogawa , Osamu Fukuroi , Takashi Fujii
- 申请人地址： JP Tokyo
- 专利权人： TDK Corporation
- 当前专利权人： TDK Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- 优先权： JP2000-181336 20000616; JP2001-179865 20010614
- 国际申请： PCT/JP01/05122 WO 20010615
- 国际公布： WO01/96063 WO 20011220
- 主分类号： B24B49/00
- IPC分类号： B24B49/00
摘要：
The present invention relates to a lapping apparatus and a lapping method that may effect further machining in response to each element on a ceramic bar to the ceramic bar that is largely locally lapped and may reduce a cost needed for machining without any jig for holding the ceramic bar. The ceramic bar is held by a surface of an elastic member made of rubber or the like. A plurality of actuators are arranged on a back surface of this elastic member. When the ceramic bar is depressed against the lapping surface, a specific portion of the ceramic bar is deformed or strongly deformed through the elastic member by these actuators to thereby make it possible to perform the lapping in response to each element.
公开/授权文献
- US20030162480A1 Magnetic head grinding device and method 公开/授权日：2003-08-28
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