Invention Grant
US06992024B2 Gapfill process using a combination of spin-on-glass deposition and chemical vapor deposition techniques
失效
使用旋涂玻璃沉积和化学气相沉积技术的组合的间隙加工方法
- Patent Title: Gapfill process using a combination of spin-on-glass deposition and chemical vapor deposition techniques
- Patent Title (中): 使用旋涂玻璃沉积和化学气相沉积技术的组合的间隙加工方法
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Application No.: US10730193Application Date: 2003-12-05
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Publication No.: US06992024B2Publication Date: 2006-01-31
- Inventor: Zhenjiang Cui , Rick J. Roberts , Michael S. Cox , Jun Zhao
- Applicant: Zhenjiang Cui , Rick J. Roberts , Michael S. Cox , Jun Zhao
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Townsend and Townsend and Crew
- Main IPC: H01L21/31
- IPC: H01L21/31 ; H01L21/469
Abstract:
A method of filling a plurality of trenches etched in a substrate. In one embodiment the method includes depositing a layer of spin-on glass material over the substrate and into the plurality of trenches; exposing the layer of spin-on glass material to a solvent; curing the layer of spin-on glass material; and depositing a layer of silica glass over the cured spin-on glass layer using a chemical vapor deposition technique.
Public/Granted literature
- US20040224496A1 Gapfill process using a combination of spin-on-glass deposition and chemical vapor deposition techniques Public/Granted day:2004-11-11
Information query
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