发明授权
- 专利标题: Semiconductor device, a method of manufacturing the same and an electronic device
-
申请号: US10755375申请日: 2004-01-13
-
公开(公告)号: US06992385B2公开(公告)日: 2006-01-31
- 发明人: Yukihiro Satou , Takeshi Otani , Hiroyuki Takahashi , Toshiyuki Hata , Ichio Shimizu
- 申请人: Yukihiro Satou , Takeshi Otani , Hiroyuki Takahashi , Toshiyuki Hata , Ichio Shimizu
- 申请人地址: JP Tokyo
- 专利权人: Renesas Technology Corp.
- 当前专利权人: Renesas Technology Corp.
- 当前专利权人地址: JP Tokyo
- 代理机构: Mattingly, Stanger, Malur & Brundidge, P.C.
- 优先权: JP2003-054638 20030228
- 主分类号: H01L23/48
- IPC分类号: H01L23/48
摘要:
A novel semiconductor device high in both heat dissipating property and connection reliability in mounting is to be provided. The semiconductor device comprises a semiconductor chip, a resin sealing member for sealing the semiconductor chip, a first conductive member connected to a first electrode formed on a first main surface of the semiconductor chip, and a second conductive member connected to a second electrode formed on a second main surface opposite to the first main surface of the semiconductor chip, the first conductive member being exposed from a first main surface of the resin sealing member, and the second conductive member being exposed from a second main surface opposite to the first main surface of the resin sealing member and also from side faces of the resin sealing member.