- 专利标题： Hybrid substrate and method for fabricating the same
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申请号： US10038172申请日： 2002-01-03
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公开(公告)号： US06994903B2公开(公告)日： 2006-02-07
- 发明人: Louis L. Hsu , Li-Kong Wang
- 申请人： Louis L. Hsu , Li-Kong Wang
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corp.
- 当前专利权人： International Business Machines Corp.
- 当前专利权人地址： US NY Armonk
- 代理商 Satheesh K. Karra, Esq.
- 主分类号： B32B3/00
- IPC分类号： B32B3/00 ; B32B9/04
摘要：
A hybrid substrate, i.e., a substrate fabricated from different materials, and method for fabricating the same are presented. The hybrid substrate is configured for fabricating more than two different devices thereon, has a high thermal conductivity, and is configured for patterning interconnects thereon for interconnecting the different devices fabricated on the hybrid substrate.
公开/授权文献
- US20030124327A1 Hybrid substrate and method for fabricating the same 公开/授权日：2003-07-03
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