Invention Grant
- Patent Title: Heat-dissipating fan module of electronic apparatus
- Patent Title (中): 电子设备散热风扇模块
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Application No.: US10691641Application Date: 2003-10-24
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Publication No.: US06995979B2Publication Date: 2006-02-07
- Inventor: Hung-Chang Hsieh , Chih-Chi Wu , Jui-Yuan Hsu , Chih-Jen Chen , Min-Wen Kao , Jen-Chieh Peng
- Applicant: Hung-Chang Hsieh , Chih-Chi Wu , Jui-Yuan Hsu , Chih-Jen Chen , Min-Wen Kao , Jen-Chieh Peng
- Applicant Address: TW Taoyuan Hsien
- Assignee: Delta Electronics, Inc.
- Current Assignee: Delta Electronics, Inc.
- Current Assignee Address: TW Taoyuan Hsien
- Agency: Bacon & Thomas, PLLC
- Priority: TW92112192A 20030502
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F01D25/26 ; F01D1/02
Abstract:
A heat-dissipating fan module of an electronic apparatus is disclosed. The heat-dissipating fan module includes a casing having an opening, the opening having a guiding device along an edge thereof, and a heat-dissipating fan fixed to one side of the casing and correspondingly disposed on the opening.
Public/Granted literature
- US20040218360A1 Heat-dispersing fan module of electronic apparatus Public/Granted day:2004-11-04
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