发明授权
- 专利标题： Method and apparatus of eddy current monitoring for chemical mechanical polishing
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申请号： US10124507申请日： 2002-04-16
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公开(公告)号： US07001242B2公开(公告)日： 2006-02-21
- 发明人: Manoocher Birang , Boguslaw A. Swedek , Hyeong Cheol Kim
- 申请人： Manoocher Birang , Boguslaw A. Swedek , Hyeong Cheol Kim
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Fish & Richardson
- 主分类号： B24B1/00
- IPC分类号： B24B1/00
摘要：
A polishing system can have a rotatable platen, a polishing pad secured to the platen, a carrier head to hold a substrate against the polishing pad, and an eddy current monitoring system including a coil or ferromagnetic body that extends at least partially through the polishing pad. A polishing pad can have a polishing layer and a coil or ferromagnetic body secured to the polishing layer. Recesses can be formed in a transparent window in the polishing pad.
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