发明授权
- 专利标题: Electronic module and method for fabricating the same
- 专利标题(中): 电子模块及其制造方法
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申请号: US10669688申请日: 2003-09-25
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公开(公告)号: US07002812B2公开(公告)日: 2006-02-21
- 发明人: Yoichiro Sakaki
- 申请人: Yoichiro Sakaki
- 申请人地址: JP Osaka
- 专利权人: Sharp Kabushiki Kaisha
- 当前专利权人: Sharp Kabushiki Kaisha
- 当前专利权人地址: JP Osaka
- 代理机构: Keating & Bennett,LLP
- 优先权: JP2002-312238 20021028
- 主分类号: H05K7/06
- IPC分类号: H05K7/06 ; G02F1/1345
摘要:
An electronic module includes an electronic circuit board having circuit elements, signal lines connected to the circuit elements, and board terminals disposed on a terminal region, and an input board and driver circuit boards mounted on the terminal region of the electronic circuit board. Each of the driver circuit boards has input terminals and output terminals. The output terminals are electrically connected to the signal lines of the electronic circuit board. The input board has main wiring lines for transmitting signals input externally, and branch wiring lines branched from the main wiring lines. The branch wiring lines are electrically connected to the input terminals of the driver circuit boards via the board terminals of the electronic circuit board.
公开/授权文献
- US20040092137A1 Electronic module and method for fabricating the same 公开/授权日:2004-05-13
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