发明授权
- 专利标题: Electronic component mounting apparatus and method
- 专利标题(中): 电子元件安装装置及方法
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申请号: US10503497申请日: 2003-02-06
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公开(公告)号: US07003872B2公开(公告)日: 2006-02-28
- 发明人: Naoto Mimura , Izumi Miura , Hirofumi Obara , Hiroshi Uchiyama , Nobuyuki Kakita , Kazunori Kanai , Osamu Okuda , Akira Kabeshita
- 申请人: Naoto Mimura , Izumi Miura , Hirofumi Obara , Hiroshi Uchiyama , Nobuyuki Kakita , Kazunori Kanai , Osamu Okuda , Akira Kabeshita
- 申请人地址: JP Osaka
- 专利权人: Matsushita Electric Industrial Co., Ltd.
- 当前专利权人: Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址: JP Osaka
- 代理机构: Wenderoth, Lind & Ponack, L.L.P.
- 优先权: JP2002-030930 20020207
- 国际申请: PCT/JP03/01216 WO 20030206
- 国际公布: WO03/067951 WO 20030814
- 主分类号: H05K3/30
- IPC分类号: H05K3/30 ; B23P19/00
摘要:
An apparatus and a method for mounting electronic components are provided which shorten a cycle time required for mounting and enable a component mounting machine to be arranged in a small area. There is provided a controller, so that a retreat control for a second electronic component is performed to a second component feeder so as to avoid an interference if a first electronic component or a component holder interferes with the second electronic component of the second component feeder because of movement of a mounting head. The time conventionally required for moving up and down a component holder can be reduced, and moreover the need of uselessly moving along a detour at a time of moving the mounting head is eliminated. The cycle time can be shortened, and eventually costs can be reduced.
公开/授权文献
- US20050125998A1 Electronic part mounting device and method 公开/授权日:2005-06-16
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