Invention Grant
- Patent Title: Metallic-based adhesion materials
- Patent Title (中): 金属基粘合材料
-
Application No.: US11053061Application Date: 2005-02-08
-
Publication No.: US07005195B2Publication Date: 2006-02-28
- Inventor: Yang-Tse Cheng , Wangyang Ni , Leonid Charles Lev , Michael J. Lukitsch , David S. Grummon , Anita M. Weiner
- Applicant: Yang-Tse Cheng , Wangyang Ni , Leonid Charles Lev , Michael J. Lukitsch , David S. Grummon , Anita M. Weiner
- Applicant Address: US MI Detroit US MI East Lansing
- Assignee: General Motors Corporation,Michigan State University
- Current Assignee: General Motors Corporation,Michigan State University
- Current Assignee Address: US MI Detroit US MI East Lansing
- Agent Kathryn A. Marra
- Main IPC: B32B7/10
- IPC: B32B7/10 ; B32B7/12 ; C22C45/00
Abstract:
A material and method for adhering at least two materials that includes the step of interposing at least one intermediate layer between the two materials and associated adhesion material. The materials to be adhered exhibit at least one characteristic dissimilarity and the intermediate material interposed contains at least one shape memory alloy, the shape memory alloy capable of exhibiting superelasticity.
Public/Granted literature
- US20050142375A1 Metallic-based adhesion materials Public/Granted day:2005-06-30
Information query
