发明授权
US07005370B2 Method of manufacturing different bond pads on the same substrate of an integrated circuit package
有权
在集成电路封装的同一衬底上制造不同接合焊盘的方法
- 专利标题： Method of manufacturing different bond pads on the same substrate of an integrated circuit package
- 专利标题（中）： 在集成电路封装的同一衬底上制造不同接合焊盘的方法
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申请号： US10846176申请日： 2004-05-13
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公开(公告)号： US07005370B2公开(公告)日： 2006-02-28
- 发明人: Lun Zhao , Wan Lay Looi , Kyaw Oo Aung , Yonggang Jin , Jae-Yong Song , Won Sun Shin
- 申请人： Lun Zhao , Wan Lay Looi , Kyaw Oo Aung , Yonggang Jin , Jae-Yong Song , Won Sun Shin
- 申请人地址： SG Singapore
- 专利权人： ST Assembly Test Services Ltd.
- 当前专利权人： ST Assembly Test Services Ltd.
- 当前专利权人地址： SG Singapore
- 代理商 Mikio Ishimaru
- 主分类号： H01L21/441
- IPC分类号： H01L21/441
摘要：
A method for manufacturing an integrated circuit package is provided with a substrate having first and second contact pads exposed through a passivation layer on the substrate. A first metallurgy layer is formed over the substrate. A second metallurgy layer is formed over the first metallurgy layer. The first metallurgy layer is removed while leaving a portion thereof over the second contact pad. The second metallurgy layer is removed while leaving a portion thereof over the second contact pad. A protective layer is formed over the first contact pad while removing the first metallurgy layer.
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