Invention Grant
US07005370B2 Method of manufacturing different bond pads on the same substrate of an integrated circuit package
有权
在集成电路封装的同一衬底上制造不同接合焊盘的方法
- Patent Title: Method of manufacturing different bond pads on the same substrate of an integrated circuit package
- Patent Title (中): 在集成电路封装的同一衬底上制造不同接合焊盘的方法
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Application No.: US10846176Application Date: 2004-05-13
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Publication No.: US07005370B2Publication Date: 2006-02-28
- Inventor: Lun Zhao , Wan Lay Looi , Kyaw Oo Aung , Yonggang Jin , Jae-Yong Song , Won Sun Shin
- Applicant: Lun Zhao , Wan Lay Looi , Kyaw Oo Aung , Yonggang Jin , Jae-Yong Song , Won Sun Shin
- Applicant Address: SG Singapore
- Assignee: ST Assembly Test Services Ltd.
- Current Assignee: ST Assembly Test Services Ltd.
- Current Assignee Address: SG Singapore
- Agent Mikio Ishimaru
- Main IPC: H01L21/441
- IPC: H01L21/441
Abstract:
A method for manufacturing an integrated circuit package is provided with a substrate having first and second contact pads exposed through a passivation layer on the substrate. A first metallurgy layer is formed over the substrate. A second metallurgy layer is formed over the first metallurgy layer. The first metallurgy layer is removed while leaving a portion thereof over the second contact pad. The second metallurgy layer is removed while leaving a portion thereof over the second contact pad. A protective layer is formed over the first contact pad while removing the first metallurgy layer.
Public/Granted literature
- US20050253262A1 METHOD OF MANUFACTURING DIFFERENT BOND PADS ON THE SAME SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE Public/Granted day:2005-11-17
Information query
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