发明授权
- 专利标题： Semiconductor package with photosensitive chip and fabrication method thereof
- 专利标题（中）： 具有感光芯片的半导体封装及其制造方法
-
申请号： US10763656申请日： 2004-01-23
-
公开(公告)号： US07005720B2公开(公告)日： 2006-02-28
- 发明人: Chien-Ping Huang , Cheng-Hsu Hsiao , Chih-Ming Huang
- 申请人： Chien-Ping Huang , Cheng-Hsu Hsiao , Chih-Ming Huang
- 申请人地址： TW
- 专利权人： Siliconware Precision Industries Co., Ltd.
- 当前专利权人： Siliconware Precision Industries Co., Ltd.
- 当前专利权人地址： TW
- 代理机构： Edwards Angell Palmer & Dodge LLP
- 代理商 Peter F. Corless; Steven M. Jensen
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L21/44
摘要：
A semiconductor package with a photosensitive chip and a fabrication method thereof are provided. A substrate having a core is prepared. A solder mask layer is applied over a surface of the core and formed with an opening to expose a continuous peripheral portion on the surface of the core. At least one photosensitive chip is mounted on and electrically connected to the substrate. An encapsulation dam is formed on the continuous peripheral portion of the core and surrounds the chip. The dam includes a shoulder portion adjacent to and flush with the solder mask layer, and a protruded support portion surrounding the shoulder portion. A lid is attached to the support portion of the dam for sealing the dam such that the chip is received in a space defined by the substrate, the dam and the lid.