发明授权
- 专利标题： Array printed circuit board
- 专利标题（中）： 阵列印刷电路板
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申请号： US10775070申请日： 2004-02-11
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公开(公告)号： US07005735B2公开(公告)日： 2006-02-28
- 发明人: Chang-Yong Park , Byung-Man Kim , Jong-Soo Choi , Kwang-Ho Chun , Se-Hyung Ryu
- 申请人： Chang-Yong Park , Byung-Man Kim , Jong-Soo Choi , Kwang-Ho Chun , Se-Hyung Ryu
- 申请人地址： KR Kyungki-Do
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Kyungki-Do
- 代理机构： Harness Dickey & Pierce P.L.C.
- 优先权： KR10-2003-0008449 20030211
- 主分类号： H01L23/02
- IPC分类号： H01L23/02
摘要：
The array printed circuit board includes at least one circuit board having a first surface. A first layout of first and second chip mounting regions is formed on a first half of the first surface and a second layout of first, and second chip mounting regions is formed on a second half of the first surface. The first and second layouts have opposite first and second chip mounting region patterns.
公开/授权文献
- US20040238932A1 Array printed circuit board 公开/授权日：2004-12-02
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